Compounds are UL listed for 94VO flame resistance

Edited by the Manufacturingtalk editorial team Jun 3, 2003

Formulated to meet the most stringent physical, thermal, and electrical properties for potting/ encapsulating electronic components, epoxy based compounds offer choices in working properties.

Formulated to meet the most stringent physical, thermal, and electrical properties for potting/encapsulating of electronic components, these three new epoxy based compounds offer unique choices in working properties and physical characteristics.

Each system is UL rated for 94VO flame resistance and characterized by superior thermal shock, excellent impact resistance, high heat distortion, and exceptional thermal conductivity.

These fine products are recommended for potting and encapsulation of coils, transformers, capacitors, chokes, solenoids, modules and electronic circuitry.

RBC # 570: * Low viscosity.

* Fast gel/cure schedule (12 minute Gel, 1 hour room temp cure).

* Shore D hardness 85.

RBC # 4501: * Medium viscosity.

* Lengthy working time (3 Hour Gel, 24 hour room temp cure).

* Shore D hardness 87.

RBC # 4503: * Low viscosity.

* Medium working length (30 minute gel, 6 hour room temp cure).

* Shore D hardness 87.