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News Release from: SGS | Subject: RoHS directive effects
Edited by the Manufacturingtalk Editorial
Team on 03 April 2006
RoHS directive effects and exceptions
discussed
The RoHS Directive covers nearly all kind of EEE designed for the use with a voltage not exceeding 1000 volts for alternating current and 1500 volts for direct current.
The RoHS Directive (2002/95/EC) bans the putting on the EU market of new electrical and electronic equipment (EEE) containing more than 0.1% lead, mercury, hexavalent chromium, PBB and PBDE and 0.01% Cadmium The RoHS Directive covers nearly all kind of EEE "designed for the use with a voltage not exceeding 1000 volts for alternating current and 1500 volts for direct current"
This article was originally published on Manufacturingtalk on 28 Jun 2007 at 8.00am (UK)
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Medical devices as well as monitoring and control instruments are not covered by the scope of the RoHS Directive.
Also the Directive does not apply to spare parts for the repair or to the reuse, of EEE put on the market before 1 July 2006.
Further exemptions are only possible due to technical reasons.
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Until now some exemptions are made as listed below.
Exemptions in force: Mercury in compact fluorescent lamps not exceeding 5mg per lamp - Mercury in straight fluorescent lamps for general purposes not exceeding; 10 mg in halophosphate lamps; 5 mg in triphosphate lamps with a normal lifetime; 8 mg, in triphosphate with long lifetime - Mercury in straight fluorescent lamps for special purposes - Mercury in other lamps not specifically mentioned in this list - Lead in glass of cathode ray tubes, electronic components and fluorescent tubes - Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight - Lead in high melting temperature type solders (ie lead based alloys containing 85% by weight or more lead) - Lead in solders for servers, storage and storage, storage array systems - Lead in solders for network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications - Lead in electronic ceramic parts (e.g piezo electronic devices) - Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under directive 91/338/EEC (OJL 186, 12.7.1991, p.59) amending directive 76/769/EEC (OJL 262, 27.9.1976, p.
201) relating to restrictions on the marketing and use of certain dangerous substances and preparations - Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators - DecaBDE in polymeric applications - Lead in lead-bronze bearing shells and bushes - Lead used in compliant pin connector systems - Lead as a coating material for the thermal conduction module c-ring - Lead and Cadmium in optical and filter glass - Lead in solder consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight - Lead in solders to complete a viable electrical connection between semiconductors die and carrier within integrated circuit Flip Chip packages Further exemptions are under discussion and reviewed but not decided yet.
As mentioned in the latest (unofficial) notes of the Technical Adaptation Committee (TAC) member states have to vote on five new exemptions.
Exemptions waiting for vote: These exemptions might be the next since they are waiting for a vote of the national committees.
- Lead in linear incandescent lamps with silicate coated tubes - Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications - Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphorus such as BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphorus such as SMS ((Sr,Ba)2MgSi2O7:Pb) - Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL) - Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD) Exemptions under discussion There are still exemptions which are not decided yet.
Stakeholders were asked to give comments on the listed exemptions from the consultation documents.
Most of the proposed exemptions are dealing with lead.
Exemptions dealing with Lead: Lead in tin whisker resistant coatings for fine pitch applications, Lead bound in glass, crystal glass, lead crystal or full lead crystal in general, Lead in lead oxide glass plasma display panels, Lead in connectors, flexible printed circuits, flexible flat cables, Lead oxide in lead glass, bonding materials of magnetic heads and magnetic heads Lead in optical isolators, Lead in sheath heater of Microwaves, Solders containing lead and/or cadmium for specific applications, Special purposes Black Light Blue (BLB) lamps, containing lead in the glass envelope, Low melting point alloys containing lead, Galvanised steel containing up to 0.35% lead by weight and aluminium with an unintended lead content up to 0.4% lead by weight in electrical and electronic equipment Lead in solder and hexavalent chromium in surface treatment, in parts recovered from production printers and copying equipment, sold, rented or leased or otherwise returned from professional users other than private households, originally put on the market before 1 July 2006, and reused for the same purpose within the original manufacturer's closed loop system until 1 July 2011.
In this context a closed loop system means a system whereby the equipment remains the property of the manufacturer or is subject to other contractual arrangements and is returned to the manufacturer either when the contract expires or at end of life, Special ICs having tin-lead solder plating on leads used in professional equipment; Solders containing lead and /or cadmium for specific applications where local temperature is higher than 150 deg C and which need to work properly more than 500 hours; Lead in solder for printed circuit boards for emergency lighting products - Specific modular units including tin-lead solder being used in special professional equipment; Lead in gas sensors - Concerning of PbO (Lead in Seal Frit) used for making BLU (Back Light Unit) Lam; Lead alloys as electrical/mechanical solder for tranducers used in high-powered professional and commercial loudspeakers - Solder tin of the thermo fuse with a defined low melting point - Lead in lead oxide glass used in plasma display panel (PDP) - Lead in solder on small PCB and tinned legs of primary components - Use of the not lead free component NEC V25 in the Memor 2000 - Lead used in shielding of radiation for Non Medical Xray equipment - Lead based solders sealed or captured within heatshrinkable components and devices - The use of lead in solder applications for electronic components of musical instruments having an average lifespan in excess of 10 years - Lead solder alloy in Surge protective devices (SPDs) - Inventory of Special ICs having tin-lead solder on/in leads/balls, used in specialist/professional equipment - Lead alloys as electrical/mechanical solder for transducers used in high-powered professional and commercial loudspeakers - Solder containing lead for applications where the local temperature exceeds 150 C and reliable operation for a minimum of 30,000 hours is required - Tin-lead solder in the manufacture of professional audio equipment - Specific modular units including tin-lead solder being used in special professional equipment - Lead in electronic vacuum tubes - Lead in aluminum used in gas valves for domestic cooking appliances 1 - Exemptions dealing with Lead: Lead in tin whisker resistant coatings for fine pitch applications, Lead bound in glass, crystal glass, lead crystal or full lead crystal in general, Lead in lead oxide glass plasma display panels, Lead in connectors, flexible printed circuits, flexible flat cables, Lead oxide in lead glass, bonding materials of magnetic heads and magnetic heads - Lead in optical isolators, Lead in sheath heater of Microwaves, Solders containing lead and/or cadmium for specific applications, Special purposes Black Light Blue (BLB) lamps, containing lead in the glass envelope, Low melting point alloys containing lead, Galvanised steel containing up to 0.35% lead by weight and aluminium with an unintended lead content up to 0.4% lead by weight in electrical and electronic equipment - Lead in solder and hexavalent chromium in surface treatment, in parts recovered from production printers and copying equipment, sold, rented or leased or otherwise returned from professional users other than private households, originally put on the market before 1 July 2006, and reused for the same purpose within the original manufacturer's closed loop system until 1 July 2011.
In this context a closed loop system means a system whereby the equipment remains the property of the manufacturer or is subject to other contractual arrangements and is returned to the manufacturer either when the contract expires or at end of life, Special ICs having tin-lead solder plating on leads used in professional equipment; Solders containing lead and /or cadmium for specific applications where local temperature is higher than 150 deg C and which need to work properly more than 500 hours - Lead in solder for printed circuit boards for emergency lighting products - Specific modular units including tin-lead solder being used in special professional equipment; Lead in gas sensors - Concerning of PbO (Lead in Seal Frit) used for making BLU (Back Light Unit) Lam; Lead alloys as electrical/mechanical solder for tranducers used in high-powered professional and commercial loudspeakers - Solder tin of the thermo fuse with a defined low melting point - Lead in lead oxide glass used in plasma display panel (PDP) - Lead in solder on small PCB and tinned legs of primary components - Use of the not lead free component NEC V25 in the Memor 2000 - Lead used in shielding of radiation for Non Medical Xray equipment - Lead based solders sealed or captured within heat shrinkable components and devices - The use of lead in solder applications for electronic components of musical instruments having an average lifespan in excess of 10 years - Lead solder alloy in Surge protective devices (SPDs) - Inventory of Special ICs having tin-lead solder on/in leads/balls, used in specialist/professional equipment - Lead alloys as electrical/mechanical solder for transducers used in high-powered professional and commercial loudspeakers - Solder containing lead for applications where the local temperature exceeds 150 C and reliable operation for a minimum of 30,000 hours is required - Tin-lead solder in the manufacture of professional audio equipment - Specific modular units including tin-lead solder being used in special professional equipment - Lead in electronic vacuum tubes - Lead in aluminum used in gas valves for domestic cooking appliances - Lead in solder of parts recovered from gaming amusement machines put on the market before 1/07/06 and reused for the same purpose within a manufacturer's closed loop until July 2014 - Lead in solders in components and assemblies used in non-consumer products, provided that: - such components and assemblies were purchased or are subject to a proven last-time buy contract placed before 1 July, 2006; and - such components and assemblies are used in models of EEE that were already available on the market before 1 July 2006 2- Exemptions dealing with Cadmium: Cadmium as doping material in avalanche photodiodes (APDs) for the optical fiber communication systems, Cadmium pigments except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to the restriction on the marketing and use of certain substances, Cadmium in opto-electronic components; Cadmium-bearing copper alloys 3- Exemptions dealing with Mercury: Mercury free flat panel lamp, Mercury in switches 4- Other Exemptions: Non-consumer mechanical power transmission systems including speed reducers and mechanical couplings which rely on electrical/ electronic components for safe control and operation - Electrical and electronic components contained in heating ventilating and air conditioning building systems, commercial refrigeration systems and transport refrigeration systems; Electrical/electronic components contained mobile and stationary air compressors and vacuum systems, compressed air contaminant removal systems and pneumatic contractor's air tools - Electrical/electronic equipment that are: used in transport -aviation, aerospace, road, maritime, rail; installed in to the fabric of buildings - elevators, escalators, moving walks, dumb waiters, and heating, cooling and ventilation systems, and fire and security systems; used in the energy generation and transmission; used in mining and mineral processing; used for non-consumer mechanical power transmission systems; industrial process pumps and compressors; used in industrial refrigeration; used in military applications - On-Semi MCR265-10 SCR - Components NEC V55 SGS has 24 accredited RoHS laboratories worldwide and 1000 specialists in this field, providing an integrated reliable evaluation of RoHS conformity. Request a free brochure from SGS ...
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