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SolderStar

Unit 20 Generation Centre Dane Street
Rochdale
OL12 6XB
United Kingdom

Latest articles from this company

News releases from this company

Assembly process temperature profiling on show

SolderStar will be exhibiting their range of hardware and software tools for assembly process temperature profiling at Nepcon UK 2007 in Birmingham (15-17th May 2007).

News from Manufacturingtalk, 9 May 2007

Thermal profiling packages introduced

Three easy-to-use thermal profiling packages are specifically for the demanding technical and budgetary requirements of low, medium and high volume lead-free electronics manufacturing.

News from Manufacturingtalk, 26 April 2006

Reflow soldering thermal profiling done in 30 min

Users of thermal profiling packages achieve an optimal thermal profile for high temperature reflow soldering after 30 min, compared with trial-and-error work with other systems.

News from Manufacturingtalk, 29 March 2006

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