Assembly process temperature profiling on show

SolderStar will be exhibiting their range of hardware and software tools for assembly process temperature profiling at Nepcon UK 2007 in Birmingham (15-17th May 2007).

On display (stand E25b) at the Nepcon UK 2007 show in Birmingham (15-17th May 2007) will be the latest range of SolderStar hardware and software tools for assembly process temperature profiling.

Available in the UK through a comprehensive network of agents and distributors, the SolderStar is gaining increasing recognition across the world by process engineers, who are finding the tools indispensable for the accurate set-up of their electronics assembly process lines.

In particular, with many electronics substrates now featuring the latest and most advanced semiconductor packages, process engineers face an increasingly challenging task to set up their wave soldering and reflow soldering processes accurately and quickly to take account of these higher-value components.

In addition, the adoption of lead-free technology on many board designs means that accurate temperature profiling set-up has become even more critical.

SolderStar's profiling tools have been developed to handle all of these challenges, and have been proven in the field to simplify reduce process set-up times significantly, resulting in high productivity, low process down-time, and maximum process yields.

Comments Mark Stansfield, Managing Director for SolderStar UK, "Through our strong agent and distributor network, we are very confident about growing SolderStar's business in the UK.

Our portfolio of SolderStar Lite, SolderStar Plus and SolderStar Pro slim profiling tools will be particularly important for companies who need to set up their manufacturing lines for low defect high yield lead-free electronics assembly results, and our agent and distributor partners will help to ensure that our profiling tools are fully supported at all stages of their implementation".

At Nepcon UK 2007, the complete product range will be exhibited where and SolderStar people on hand to demonstrate the benefits of the SolderStar profiling tools.

On show will be: SolderStar PRO: Designed for manufacturers and EMS providers looking for the ultimate in temperature profiling, the SolderStar Pro package takes profiling capability to the highest level and provides true process profiling for optimum quality control.

The SolderStar Pro includes the ultra-compact slim-line footprint Neptune SL datalogger for industry-leading accuracy, and the unique 'SmartLink' connector system.

'SmartLink' allows high measurement channel configurations, while maintaining a small footprint and connection to a range of accessories for capture of SPC information from both reflow and wave soldering processes.

A comprehensive suite of full- feature software includes profile simulations and integrated SPC charting tools.

Ideal for manufacturers and EMS providers who profile periodically to form a complete mass soldering quality control tool, SolderStar PRO provides up to 32 measurement channels for profiling of the most complex assemblies.

SolderStar PLUS: Designed specifically to meet the demands of manufacturers and EMS providers requiring a thermal profiling system for daily use as part of an ongoing quality control regime, on a wide range of PCB assemblies, the SolderStar Plus package sets the benchmark for maintaining lead-free thermal processes under absolute control.

The SolderStar Plus package features the industry's slimmest and most robust 6-channel datalogger.

This easily fits into ovens with limited tunnel height and stays cool there, even at lead-free processing temperatures, due to its outstanding heat shielding properties.

A fully-featured software package is also included with tools for detailed profile analysis, good/bad testing, optimisation and ISO traceability.

It features high lead-free thermal protection and rapid cool down cycles, and extensive oven and solder paste libraries to aid rapid process set-up and optimisation.

SolderStar LITE: Ideal for smaller ovens or simpler PCB assemblies, SolderStar LITE makes the transition to lead-free manufacture easy.

It is extremely simple to use, yet offers full thermal profiling capabilities, enabling users to establish and maintain the correct temperature and speed settings for the reflow processes, quickly and easily.

Featuring SolderStar's world-class 4-channel Neptune datalogger and PC analysis software, SolderStar LITE combines measurement accuracy, outstanding thermal performance and simplicity to provide one of the industry's best entry-level thermal profiling systems.

Specially designed to offer professional profiling for the limited budget, it is tailor-made for the novice profiler, small volume or low-complexity PCB manufacturer, or as a second system.

DeltaProbe PRO: The DeltaProbe is a reflow soldering accessory that works in conjunction with the SolderStar Pro temperature profiling system.

It effectively removes the need to use fragile test boards for the periodic profiling required for ongoing control of the reflow process.

With fixed sensors and no test card or long trailing wires, the SolderStar DeltaProbe is a fixed, robust and convenient platform for generating highly repeatable results.

Although process set-up requires a temperature profile captured from a real test PCB, ongoing process monitoring can be achieved by measuring the difference from an established process baseline.

Periodically, the SolderStar DeltaProbe is passed through the process to allow rapid checks against the baseline profile and SPC data to be captured.

Process change, due to variations in convection levels, conveyor speed or zone set-points, is instantly and accurately detected and the operator is notified visually.

Advanced SPC tools create charts for ongoing process control measurement, evaluation and corrective action.

SolderStar APS - Automatic Profiling System: SolderStar APS uses the latest evolution of reflow data logger to provide both pass-through profiling functions combined with a full time process monitoring solution, capable of providing a profile for every board, in a single hardware platform.

Ultra-thin sensor probes are permanently mounted along the length of the reflow oven to measure product level temperature.

This newly developed probe allows for a smaller physical size which offers two significant advantages, fast response to changing oven loading and the elimination of shadowing problems associated with components mounted close to the conveyor rails.

Product speed and position are monitored by way of high accuracy real-time speed monitoring instrumentation, board-in sensors and a new software algorithm, resulting in a 'True Profile' for every board processed.

PC software automatically calculates all important process parameters and checks for values outside defined limits for the process.

On exit of the board from the machine this information, along with a board ID is stored in a database for complete product traceability.

Should the measured parameters drift outside process limits then the system immediately stops further entry of boards into the machine via a standard SMEMA interface and alerts line staff that remedial action is required.

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