Product category:
Materials Testing
News Release from: TM Electronics
Edited by the Manufacturingtalk Editorial
Team on 26 January 2004
Mini-Course On Non-Destructive Leak
Testing
TM Electronics mini-course "Leak Testing 301" is designed to help the design or quality engineer grasp the fundamentals and vocabulary to determine a product's leak and/or package testing needs.
TM Electronics is pleased to introduce the third in a series of informational "mini-courses" designed to help the design or quality engineer acquire a grasp of the fundamentals and vocabulary to determine a product's leak and/or package testing needs: Leak Testing 301: Non-Destructive Pressure Decay Chamber Leak Testing This mini-course joins TM Electronics' series of informational booklets, Leak and Flow Testing 101, and Package Testing 201
This article was originally published on Manufacturingtalk on 2 Jun 2006 at 8.00am (UK)
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Every-day leak, flow and occlusion tester
TM Electronics will introduce the newest member of the TME family of leak, flow and package testers at the MDandM-East 2006 Show in New York City.
Specifically oriented toward the non-destructive testing of closed products or non-porous packages that cannot be pressurized, Leak Testing 301 explores the use of pressure or vacuum decay surrogate chamber testing as a highly sensitive, repeatable and efficient test method that can be adapted to a wide variety of testing situations.
These booklets, written by Stephen Franks, are available at no cost from TM Electronics or electronically at their website.
Mr Franks is well known throughout the industry as author of numerous articles and presenter of workshops on various topics in leak science.
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