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Ion migration and lead-free solder evaluation
An
Unitemp product story
Edited by the Manufacturingtalk editorial team
May 9, 2007
Unitemp has announced the AMI series from ESPEC, a versatile ion migration and lead-free solder evaluation system that detects the decline of insulation resistance by continuous measurement.
Unitemp has announced a high quality ion migration and lead-free solder evaluation system.
This versatile system has been designed to meet the requirements of evaluations of ion migration and insulation resistance and help overcome the problems that occur as electronic devices are miniaturised and mounted with higher density and lead-free solder.
Designated the AMI series from ESPEC, this system detects the decline of insulation resistance by continuous measurement whilst applying voltage under high temperature and high humidity conditions.
The leak detection function detects the occurrence of ion migration in microsecond intervals.
The stress voltage to the channel is immediately shut off when leak-touch is detected.
Other features include measuring applied voltage, stress charge voltage, continuous testing time, measuring time and current leak detection interval.
The system includes an international standard traceable precision measurement instrument to guarantee accurate and compatible measurement data.
Tests are simplified by interaction of the measurement with various environmental test chambers.
Up to three test chambers can be connected for testing specimens with real time monitoring of humidity and temperature.
Rapidly increasing the humidity at the beginning of the test can generate dew condensation on the specimen.
This problem is overcome by a delay control.
This easy to use system complements Unitemp's extensive range of test and monitoring chambers / ovens, and they have the expertise to provide specials to customer requirements.
This system is primarily for use in the electronic industry but has applications in the engineering, process, manufacturing, laboratory and defence industries.
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