Product category:
Manufacturing IT hardware
News Release from: VIA Technologies | Subject: Eden
Edited by the Manufacturingtalk Editorial
Team on 09 June 2005
VIA Eden Platform Powers New HP Thin
Clients
Proven ultra-low power VIA Eden processor selected by HP for new range of space-saving thin clients
VIA Technologies, a leading innovator and developer of silicon chip technologies and PC platform solutions, has announced that the high-performance, energy-efficient VIA Eden Platform will be integrated into the new HP Compaq t5125, t5520 and t5525 thin clients Bringing enhanced levels of performance, reliability and functionality to the corporate environment, this design win further strengthens VIA's leadership in this fast-emerging market segment
This article was originally published on Manufacturingtalk on 19 Jan 2006 at 8.00am (UK)
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Providing businesses with greater manageability, scalability, security and flexibility, thin clients offer a holistic cost-effective approach to corporate productivity with a network-based computing model.
The new HP Compaq t5125, t5520 and t5525 fine-tune the concept with a range of smart, small footprint designs, capable of meeting the demands of the corporate environment with the high-performance, ultra-low power of VIA Eden processors.
"We are delighted that HP has adopted the VIA Eden Platform for their new range of thin client products, strengthening our presence in this rapidly growing market," commented Richard Brown, Vice President of Marketing, VIA Technologies "These new thin clients leverage our unique combination of power efficiency, performance and security." The new range of HP Compaq thin clients feature the highly energy-efficient VIA Eden ESP processor with ultra-low thermal profile, enabling higher performance in a small form factor and fanless design, and feature 128MB RAM and up to 256MB Compact Flash that offers enough storage memory for most current firmware and future updates and upgrades.
"By using the VIA Eden Platform, our thin clients are using lower power for key components which will provide our customers with the lifecycles and return on investment they expect from HP," said Greg Schmidt, Product Marketing Manager, Thin Client Marketing, Imaging and Personal Systems Group, HP.
"Additionally, VIA's high-performance, low-power design allows for a smaller footprint.
This is a big bonus to a traditional desktop customer wishing to capitalize on the security and manageability of thin client computing in a small, reliable, and cost efficient client." The new thin clients are expected to be available mid-June 2005.
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