Techsil introduces self-bonding LED encapsulant

Techsil has introduced the IVS4742 encapsulant for low-pressure light-emitting-diode (LED) onboard lens moulding.

Developed by Momentive Performance Materials, the self-bonding LED encapsulant material has a viscosity and clarity that enable low-pressure direct onboard lens moulding.

Direct onboard lens moulding combines the potting, lens moulding and mounting steps in a single process.

The IVS4742 is a two-component, addition-cure silicone rubber specifically designed for optical device coating.

Its low viscosity and pressure can help to minimise the risk of LED damage.

The cure speed of the IVS4742 typically enables it to be de-moulded after two minutes at 150C; further post-cure is required to assure the completion of the cure and adhesion to substrates.

Naturally, the mould itself needs to feature simple de-moulding properties, such as a Teflon layer.

Some of the key features of this silicone rubber include: excellent transparency; low viscosity, facilitating flow; a 1:1 mix ratio by weight; and good adhesion to PPA.

Back to top