Product category:
Control and inspection equipment and services
News Release from: Xyalis | Subject: Thickness measurement
Edited by the Manufacturingtalk Editorial
Team on 02 July 2007
High-accuracy thickness measurement of
wafers
Xyalis has announced an advanced methodology for building CMP models using "non destructive" nanometric measurement equipment.
Xyalis has announced that thanks to "non destructive" nanometric measurement equipment, Xyalis is able to build Chermo Mechanical Planarization (CMP) models These models are used for estimating the critical areas where dummy filling is needed to smooth the thickness variation
This article was originally published on Manufacturingtalk on 15 Jan 2004 at 8.00am (UK)
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With advanced processes starting at 65nm and below, using a model based estimator is a must to find critical areas and reduce the number of dummy tiles inserted and thus, reduce the parasitics and yield lost.
This measures are available within a collaboration of Xyalis and CIME - Nanotech (Minatec Research centre) in Grenoble.
Thanks to this partnership, Xyalis will be able to provide high accuracy thickness measurements on wafers.
Building a model is a complex process that must be qualified by "non destructive" measures on production chips.
These measures help to analyse the layers thickness and fine tune the model.
All the requested data to build these models can be obtained with an Atomic Force Microscope (AFM).
With a resolution possibly going to less than 1nm, accuracy is no more a challenge.
GTsmooth, Xyalis density estimator and tiling engine, uses such model.
With these measures, Xyalis will reduce the time needed in building a specific model.
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